NTD78N03T4G【PDF 1/7 页】MOSFET N-CHAN 25V 78A DPAK

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Sheet目录488

[1页]2页 3页 4页 5页

NTD78N03

Power MOSFET

25 V, 78 A, Single N?Channel, DPAK

Features

? Low R DS(on)

? Optimized Gate Charge

? Pb?Free Packages are Available

http://onsemi.com

Applications

? Desktop VCORE

? DC?DC Converters

? Low Side Switch

V (BR)DSS

25 V

R DS(on) TYP

4.6 @ 10 V

6.5 @ 4.5 V

I D MAX

78 A

MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)

Parameter

Drain?to?Source Voltage

Gate?to?Source Voltage

Symbol

V DSS

V GS

Value

" 20

Unit

N?Channel

Continuous Drain

Current (Note 1)

T C = 25 ° C

T C = 85 ° C

I D

14.8

11.5

Power Dissipation

T C = 25 ° C

P D

2.3

(Note 1)

Continuous Drain

Current (Note 2)

Power Dissipation

(Note 2)

Continuous Drain

Current (R q JC )

Power Dissipation

Steady

State

T C = 25 ° C

T C = 85 ° C

T C = 25 ° C

T C = 85 ° C

T C = 25 ° C

I D

P D

I D

P D

11.4

8.8

1.4

1 2

CASE 369AA

DPAK

(Bend Lead)

STYLE 2

CASE 369D

DPAK

(Straight Lead)

STYLE 2

2 3

CASE 369AD

IPAK

(Straight Lead)

(R q JC )

Pulsed Drain Current t p = 10 m s

Current Limited by Package T A = 25 ° C

Drain to Source dV/dt

Operating Junction and Storage Temperature

Source Current (Body Diode)

Single Pulse Drain?to?Source Avalanche

Energy (V DD = 24 V, V GS = 10 V,

L = 5.0 mH, I L (pk) = 17 A, R G = 25 W )

I DM

I DmaxPkg

dV/dt

T J , T stg

I S

E AS

210

8.0

?55 to 175

722.5

V/ns

° C

Drain

MARKING DIAGRAMS

& PIN ASSIGNMENTS

Drain

1 Drain 3

Gate Source Gate Drain Source

Lead Temperature for Soldering Purposes

(1/8 ″ from case for 10 seconds)

THERMAL RESISTANCE

Junction?to?Case (Drain)

T L

R q JC

260

1.95

° C

° C/W

1 2 3

Gate Drain Source

Junction?to?Ambient ? Steady State (Note 1)

Junction?to?Ambient ? Steady State (Note 2)

R q JA

110

78N03

= Year

= Work Week

= Device Code

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

= Pb?Free Package

Recommended Operating Conditions may affect device reliability.

1. Surface?mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in

sq [1 oz] including traces).

2. Surface?mounted on FR4 board using the minimum recommended pad size.

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 5 of this data sheet.

? Semiconductor Components Industries, LLC, 2006

September, 2006 ? Rev. 6

Publication Order Number:

NTD78N03/D

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